The topics of interest for submission include, but are not limited to:
◕ Advanced Semiconductor Devices
· New Semiconductor Materials and Devices
· High-Performance Transistor Technologies
· Power Semiconductor Devices
· III-V and Compound Semiconductor Devices
· Optoelectronic Sensors and Signal Detection
· Semiconductor Lasers and Applications
· Two-Dimensional Material Devices
· Quantum Devices and Technologies
· Emerging Memory Technologies
· Cryogenic and Low-Temperature Electronics
· High-Frequency and High-Power Devices
· Silicon Photonics and Optical Communication
· Tunnel Field-Effect Transistors
· Device Reliability and Characterization
· Advanced Packaging and Interconnects
◕ Integration Technology
· Three-Dimensional Integrated Circuits
· System-on-Chip (SoC) Design
· Heterogeneous Integration
· Advanced Packaging Technologies
· Thermal Management in ICs
· RF and Microwave Integrated Circuits
· AI Hardware and Edge Computing
· Analog and Mixed-Signal ICs
· Power Management ICs
· IC Reliability and Security
· Silicon Photonics Interconnects
· Ultra-Large-Scale Integration
· Memory-Centric Computing Architectures
· MEMS and Sensor Integration
· Intelligent Sensor Systems