Call For Papers

The topics of interest for submission include, but are not limited to:

◕ Advanced Semiconductor Devices

· New Semiconductor Materials and Devices

· High-Performance Transistor Technologies

· Power Semiconductor Devices

· III-V and Compound Semiconductor Devices

· Optoelectronic Sensors and Signal Detection

· Semiconductor Lasers and Applications

· Two-Dimensional Material Devices

· Quantum Devices and Technologies

· Emerging Memory Technologies

· Cryogenic and Low-Temperature Electronics

· High-Frequency and High-Power Devices

· Silicon Photonics and Optical Communication

· Tunnel Field-Effect Transistors

· Device Reliability and Characterization

· Advanced Packaging and Interconnects


◕ Integration Technology

· Three-Dimensional Integrated Circuits

· System-on-Chip (SoC) Design

· Heterogeneous Integration

· Advanced Packaging Technologies

· Thermal Management in ICs

· RF and Microwave Integrated Circuits

· AI Hardware and Edge Computing

· Analog and Mixed-Signal ICs

· Power Management ICs

· IC Reliability and Security

· Silicon Photonics Interconnects

· Ultra-Large-Scale Integration

· Memory-Centric Computing Architectures

· MEMS and Sensor Integration

· Intelligent Sensor Systems


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